According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is projected to expand from USD 5.35 billion in 2026 to USD 11.11 billion by 2034, ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to ...

SINGAPORE, SG / ACCESS Newswire / November 25, 2025 / Dr. Byung Joon Han, co-founder and CEO of Silicon Box attended the ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The rapid evolution of wide band gap (WBG) power electronics, particularly SiC and GaN-based devices, demands advanced packaging materials capable of ...

Gigaphoton delivered its G300K excimer laser for advanced packaging to a Japanese company engaged in R&D; it will be showcased at SEMICON Japan 2025.

Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources. Save my User ID and Password ...

A new technical paper titled “A color-coded light-induced heating technology for Pb-free solder joints of advanced ...

IC packaging leadframe demand is expected to fall further in the fourth quarter of 2022 and shows no signs of recovery, as inventory adjustments for commodity chips are taking longer than expected, ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

Izmo has outlined a "dual-engine" expansion strategy that uses its profitable automotive SaaS and digital businesses to fund ...